[Work 100%] Log info konfigurasi ic eMMC/eMCP ZTE Blade S6 Latest Update

Flash & reset & Repair guide

VCC: tiga.3 V, VCCQ: 2.8 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-tiga.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG2e (0x484147326505), rev: 0x07, serial number: 0x9A59E897
Manufacturing date: Mar2019
CID: 90014A48 41473265 05079A59 E8973216
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Capacity: 14.69 GiB(15,774,777,344 bytes)
Partition isu:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,762,194,432 bytes)
Cache size: 1 MiB
Partition configuration: 0x78
Boot acknowledge is sent during the boot operation
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID ROM detected:
platform: msm8916, cpu abi: armeabi-v7a
manufacturer: ZTE
board: MSM8939, name: Blade-S6
brand: ZTE, model: Blade S6
build id: LRX22G, version: lima.0.dua (ZTE_AS_Blade_S6V1.0.0B12)
build description: msm8916_32-user 5.0.2 LRX22G eng.zte.20150508.150143 release-keys

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